BGA Rework-Rework Stations-infrared Stations-Jovy systems

Product details

Jovy Systems® provides integrated re-balling solution from a combination of high quality stencils and full list of sphere solder balls. Solder balls are provided in different diameters, to meet the majority of rework and repair purposes for the IC chip packages.
Unlike the problems might occur from using the solder paste with mask stencil method in the latest IC package types. The sphere solder balls are the most accurate and easy way for re-balling process.
Sphere solder balls of each size are provided with minimal tolerances to achieve successful re-balling process.