 JV-003
BGA rework RE-8500
- • BGA rework Multiple profiling options (standard lead-free, standard leaded and user define).
- • Wide lower heating area (500mmx 450mm).
- • Five channels thermocouple real time temperature reading.
- • Process & profile analyzer for complete process study and control.
- • Accurate temperature readings of +/- 2°C.
- • Alarm set point to increase the process safety and control.
- • Equipped with many types of reflectors for focusing and spotting the upper heater heating area.
- • Password protection for data and settings lock.
- • High ramp preheating and reflow up to 2.5°C/sec.
- • Optimum heating with 3 controlled heating zones.
- • Ideal application cooling phase in two methods optionally direct and indirect air flow, adjustable airflow power fan.
- • All Windows multi lingual OS.
Specifications
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Dimensions L x W x H
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520mm x 600mm x 310mm
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Working depth
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220 mm
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Power supply
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230 V AC, 50/60 Hz,16 A
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Installed heating power
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Total 3600 Watt. Upper heater power is 600W & Lower heaters power are 3000W
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Upper heater size
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60mm x 120 mm one zone
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Bottom heater size
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340mm x 280mm ,2 separate heating zones |
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Distance of Upper heater to PCB
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Standard is 60 mm , range from 30mm to 80mm
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Distance of Lower heater to PCB
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35 mm
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Temperature sensor channels
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5 x k-type thermocouple (potential free) 2 main and 3 optional
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Maximum component size PL
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120mm x 60 mm
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Control
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via PC with Jovy control room USB 2.0
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Operating Systems
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Windows XP® or Windows Vista® Windows7®
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- • Interactive and Easy to use Interface.
- • Multi-languages interface.
- • Fast USB 2.0 connection.
- • Profiles:
- Profiles Creation: where the user can create standard profiles or free profiles then download it to RE-8500 memory
or save it on PC.
- Profiles Editing: user can load any pre-saved profile on PC and edit its parameters.
- Profile manager mode: where the user will be able to import, edit, delete and save the profiles saved on RE-8500
memory could be re-download it to RE-8500.
- Retrieve any profile stored in RE-8500 memory to run it through the interface.
- • Processes:
- Run manual processes or pre-saved Profile process.
- Monitoring heat distribution on PCB by drawing thermo-couples reading on different five positions in a real time.
- Do analysis on run process thermo-couples reading in real time.
- Save unlimited number of run process graphs and data (thermo-couples reading) files.
- Complete process thermal behavior analysis tool.
- • Upgrade RE-8500 firmware through Software through USB 2.0 connection.
- • Full Control of all RE-8500 peripherals like fan, pump and laser.
- • Support Celsius and Fahrenheit temperature unit standards.
- Offline mode: Can create profiles and analyze run process data files without connecting RE-8500.
Business field
- • Laptop and mother boards rework and repair.
- • Game consoles applications rework and repair.
- • Small and medium size electronics assembly factories.
- • Military sophisticated applications rework and repair.
- • Medical equipment applications rework and repair.
- • Automotive applications rework and repair.
- • Light systems and LED applications.
- • Home appliance and personal Gadgets applications rework and repair.
- • Networking and communication applications rework, repair and assembly.
- • Power supply and control PCB applications rework, repair and assembly.
Components type
- • BGA on Flex printed circuit.
- • PTH connectors, card slots and sockets.
- • Metal components housing.
- • Micro lead frame.
- • PBGA with heat sink.
- • Processor plastic sockets.
- • Metal Shielding.
- • CSP and fine pitches BGA.
- • Plastic PLCC.
- • Through hole sockets.
- • Heavy Mass CCGA & CBGA.
- • Underfill or epoxy coated components.
- • QFN, VQFN and advanced design QFN.
- • Package over package (POP).
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